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Extending hotswap performance with LFPAK88

How Copper Clip Makes Perfect Packages for the Future of Power

Discrete MOSFETs Finally Get the Models they Deserve

Switch on with tiny MOSFETs

Nexperia Design Engineer’s Guides

JayKay：驾驭能量潮流

How DFN packages reduce device size while delivering on thermal performance

适用于36 V电池的高效隔离

利用增强型SOA缩小热插拔管脚尺寸

LFPAK88 – 在每立方毫米内提供更高功率

MLPAK33 – 3x3 MOSFET的灵活选择