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650 V GaN FETs – from invention to industrialization

Enabling AOI for leadless DFN packages with side wettable flanks

Is today’s accepted MOSFET Figure of Merit still relevant?

The Power MOSFET Design Engineer’s Guide

LFPAK88: A very cool customer

Turning up the heat on reliability

LFPAK88 takes a shorter path to efficiency

Combination or configurable logic: when to use which and how?

Why Trench Schottky rectifiers are the preferred choice

LFPAK88 – more power packed in every cubic millimeter

SOT23: 50 years of surface mount innovation in one package