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How DFN packages reduce device size while delivering on thermal performance

LFPAK88 – 在每立方毫米内提供更高功率

电机控制和转换效率对汽车应用至关重要

如何节省空间、减少器件数量并提高汽车动力总成中电磁阀和致动器应用的可靠性

优化MOSFET以满足特定应用的需求

DFN and wave soldering

让汽车行业轻松转入无引脚时代

Trench 9 LFPAK33 MOSFET驱动高达300 W的动力总成系统

Putting high-performance computing into cars: automotive discrete semiconductors for autonomous driving

How Advanced Driver-Assistance Systems (ADAS) Impact Automotive Semiconductors

带有可湿性侧面的无引脚DFN封装助力于实现PCB焊点的AOI