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Diode fundamentals, characteristics and applications

Nexperia Design Engineer’s Guides

JayKay：驾驭能量潮流

How DFN packages reduce device size while delivering on thermal performance

适用于36 V电池的高效隔离

Enabling a Major Leap in Power Density: Trench Schottky technology makes for a compact, efficient power supply

利用增强型SOA缩小热插拔管脚尺寸

LFPAK88 – 在每立方毫米内提供更高功率

为什么说沟槽肖特基整流器是理想选择？

GaN FET助力80 PLUS钛金级效率

MLPAK33 – 3x3 MOSFET的灵活选择